Four engineering students receive ACEC NY Scholarship Awards
Since 2012, ACEC New York has administered a statewide scholarship program in order to promote consulting engineering to the next generation, award outstanding engineering students and help New York retain promising young talent.
by Sarah D'Iorio
Published May 31, 2016 This content is archived.
Three undergraduate students in the Department of Civil, Structural and Environmental Engineering and one undergraduate student in the Department of Mechanical and Aerospace Engineering have been awarded scholarships from member firms of the American Council of Engineering Companies of New York (ACEC New York).
Jacob Dominesey (civil engineering/business administration), Daniel Henry (mechanical engineering), Derek Johnson (civil engineering), and Hailie Suk (environmental engineering) each received a $2,500 scholarship. Dominesey received the STV Group Scholarship, Henry received the WSP | Parsons Brinckerhoff Scholarship, Johnson received the ACEC New York Western Region Scholarship, and Suk received the AECOM Scholarship.
The UB students and other scholarship recipients who attend upstate colleges will be recognized at the council’s winter conference in Albany on January 29, 2017.
Since 2012, ACEC New York has administered the statewide scholarship program in order to promote consulting engineering to the next generation, award outstanding engineering students and help New York retain promising young talent. The scholarships are awarded based on the students’ cumulative grade-point average, college activities, work experience and essays on consulting engineering.
ACEC New York is made up of more than 280 firms representing every discipline of engineering related to the built environment—civil, structural, mechanical, electrical, geotechnical—and affiliated companies. The organization’s mission is to further the business interests of its members through advocacy, networking, education and business services.