Published November 10, 2021
Buffalo Business First reported that UB is partnering with local manufacturer Tapecon Inc. to produce an innovative new product — flexible hybrid electronics.
UB’s research team, led by Shenqiang Ren, professor of mechanical and aerospace engineering, has designed and developed a copper-based conductive ink that can withstand high temperatures and be printed on flexible materials. Tapecon Inc. is partnering on the project to determine the feasibility of manufacturing and commercializing it. “Reliability testing is what they’ll help with,” said Ren. “You want to test how economically viable it is. That’s one of the goals of Nextflex, commercialization. That’s why the role of Tapecon is very critical — they have the capability to do the manufacturing efforts.”