Update Your Alumni Directory Listing

Complete this form to update your information in the CBE Alumni Directory Listing or send us some current news! We'd love to know what you're up to and how you're doing.

UB Electronic Packaging Laboratory

 

                                                                                                                                                                                   

 

                       

 

                                                                                                                            

 UB Home Page| The School of Engineering and Applied Sciences                                                                                                    

   


     ● Home

      People

       Services

       Equipment

       Publications

       Sample Projects

       In the News

       Clients & 
     
     Sponsors

      
Employment

      
Contact Us

  Home

 

The Electronic Packaging Laboratory is an interdisciplinary research center of the University at Buffalo, The State University of New York. The purpose of this laboratory is to develop the computational and experimental tools needed to develop the next generation of nanoelectronics and nanophotonics devices.

Conducting research for the next generation of nanoelectronics/ nanophotonics requires interdisciplinary collaboration between experts in solid mechanics, structural analysis, materials, electronics, circuits, photonics, heat transfer, fluid mechanics, manufacturing and design. The EPL strives to educate competitive and self-motivated students and professionals with state-of- the-art knowledge in interdisciplinary research in a unique interdisciplinary environment.

Our graduates have been hired by Microsoft, IBM, Analog Devices, Honda Electronics, Tyco Electronics, among many other prestigious companies.

 

   

                         Flip Chip Solder Joint Under EM+TM                                                           Moire Interferometry

                     

                                Multi-Scale Analysis of Electromigration and Thermomigration

                     

                 bSn Surface Diffusivity                             Molecular Dynamics Simulation                                   Finite Element Analysis              

    

 

   Contact Us:

For further information, please contact Dr. Cemal Basaran (cjb@buffalo.edu).

102 Ketter Hall • Buffalo, New York 14260 • Phone: 716-645-4375 • Fax: 716-645-3733